Brief introduction of polished silicon wafers
Size 1 inch to 4-inch range, thickness 0.2 mm, 0.4 mm, 1 mm, 1.2 mm and other thickness, single-sided polishing.
Parameters and applications of polished silicon wafers:
|Method of growth
|Czochralski single crystal (CZ)
|dopant (phosphorus or boron)
|＜0.0015 Ω.cm 0.001-0.5Ω.cm 1-10Ω.cm
|iIt is used to fabricate microfluidic chips, such as photolithography process, synchrotron radiation sample carrier, LPCVD/PECVD film as the substrate, magnetron sputtering sample, XRD, SEM, AFM, infrared spectrum, as well as in the Molecular beam epitaxy of Crystal Semiconductor.