6 Factors affecting spin coating film thickness

Drip the photoresist onto the surface of the substrate material: The solution or photoresist to be coated can be sprayed or dripped onto the substrate surface using a syringe nozzle. The amount of photoresist usually dripped far exceeds the amount of glue eventually applied to the surface.
The rotating speed of the base material can quickly reach the desired rotating speed by accelerating very quickly and very briefly.
Set a constant speed and length of rotation of the base by changing the viscosity of the photoresist force to change the thickness of the film.
Set a constant rate and length of rotation of the substrate by changing the photoresist of the gel to change the thickness of the film.
The spin coating time is constant, and the thickness of the film is changed by changing the rotation speed of the substrate.
The coating speed is constant, and the thickness of the film is changed by changing the rotation time of the substrate.