Spray Developing Machine

1. Product introduction

The spray developing machine (WH-PXY-01) is a product independently developed by Wenhao Co., Ltd. with independent intellectual property rights. It is designed and developed for the development process in the photolithography process and can be used for silicon wafers with specifications below 5 inches. Carry out program-controlled automatic development. This equipment can completely replace the manual development link in the production process of microfluidic chips, and overcome the uncontrollable amount of developer added in the manual development process, uncontrollable silicon wafer development time, and uncontrollable development effect between silicon wafers of the same specification. It reduces the development quality problems caused by the operator’s human factors and the damage of the silicon wafer.

2. Technical parameters

Speed: 0~400RPM

Liquid volume control: 10~500mL

Adaptable silicon wafer/chip: 3 inches, 4 inches, 5 inches

Developing time: 0~900s

Inlet speed: 0~100%

Power input: AC220V±10V/50HZ

Power: 100W

Weight: 20 kg

Dimensions: 410 (W) * 410 (D) * 350 (H) mm

Working environment: temperature 0℃-40 ℃, relative humidity<80%

Spray Developing Machine

Spray Developing Machin

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