Mirochem SU-8 photoresist 3000 series

Brief introduction of Microchem SU 8 photoresist series

 

The new chemically amplified negative SU-8 photoresist is a negative, epoxy, near-ultraviolet photoresist, which overcomes the shortage of depth-to-width ratio caused by UV photoresist. It is very suitable for fabricating high aspect ratio microstructures. SU-8 photoresist has a low light absorption in the near-ultraviolet (365nm-400nm) range, and the exposure of the photoresist layer is uniform. The thick film with vertical sidewall and high aspect ratio can be obtained. It also has good mechanical properties, chemical corrosion resistance, and thermal stability. SU-8 crosslinked by UV radiation is a chemically amplified negative adhesive, forming steps and other complex structures. SU-8 adhesive is non-conductive and can be used directly as an insulator in electroplating. Due to its many advantages, SU-8 is gradually being used in MEMS, chip packaging, and micro-machining. At present, the direct use of SU-8 photoresists to prepare high aspect ratio microstructures and micro-parts has become a new technology in micro-machining.

 

Cleaning process of Microchem SU 8 photoresist before photolithography

 

If you want to obtain a better photolithography effect, the substrate needs to be cleaned before photoresist coating. The commonly used cleaning method uses concentrated sulfuric acid and hydrogen peroxide mixed solution immersion, followed by cleaning with deionized water and blowing dry with nitrogen. In addition, it can be cleaned by Reactive-ion etching or plasma surface cleaner.

 

Microchem SU 8 photoresist lithography process

 

The SU-8 photoresist component is spin-coated on the substrate with a thickness of several to several hundred microns. The coated wafers are dried before being cooled to room temperature. In the drying process, the preferential selection of uniform heating and precise temperature control of the heating plate; can not use the air blast drying box to prevent the photoresist surface priority curing to prevent the evaporation of the inner photoresist solvent. After cooling, the negative mask is exposed to the coated wafer, and the UV radiation dose at the mercury lamp is 10-250 MJ/cm? Under the right conditions. After exposure, choose the appropriate baking temperature and time. The wafer is developed by immersion in the developer and then blown dry with nitrogen.

 

Advantages of SU-8 photoresist

 

  1. The SU-8 photoresist has a low light absorption in the near-ultraviolet (365nm-400nm) region, and the exposure of the photoresist layer is uniform. The thick film pattern with vertical sidewall and high aspect ratio can be obtained

 

  1. SU-8 photoresist has good mechanical properties, chemical corrosion resistance, and thermal stability

 

  1. SU-8 was crosslinked after being exposed to UV radiation. It is a chemically amplified negative gel, which can form a complex structure such as step

 

4, SU-8 glue does not conduct electricity when electroplating can be used directly as an insulator.

 

Due to its many advantages, SU-8 is gradually being used in MEMS, chip packaging, and micro-machining fields. At present, the direct use of SU8 photoresist to prepare high aspect ratio microstructures and micro-parts has become a new technology in micro-machining. In microfluidic chip processing, SU-8 has mainly used for rapid molding of PDMS microfluidic chips.

Type and parameters of photoresist

Name of photoresist Type Spin thickness Spec
MicroChem SU-8 Negative glue SU-8 2000.5 0.5-0.8μm 100ml;500ml;1L;1加仑
MicroChem SU-8 Negative glue SU-8 2002 2-2.9μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2005 5-8μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2007 7-13μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2010 10-20μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2015 13-38μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2025 20-80μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2035 35-120μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2050 40-170μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2075 60-240μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2100 100-260μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 2150 190-650μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 3005 5-10μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 3010 8-15μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 3025 22-60μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 3035 32-80μm 100ml;250ml;500ml;1L
MicroChem SU-8 Negative glue SU-8 3050 44-100μm 100ml;250ml;500ml;1L
Merck AZ Positive/negative interchangeable photoresist AZ 5214 0.5-6μm 100ml;500ml;1L;1Gallons
AZ 50XT Positive glue AZ 50XT 40-80μm 100ml;500ml;1Quart
AZ 9260 Positive glue AZ 9260 6.2-15μm 100ml;250ml;500ml;1L;1Gallons
AZ2020Positive glue AZ nl0F2020 >4μm 1Gallons
AZ1500 Positive glue AZ 1500(4.4cp/20cp/38cp) None 1Gallons
AZ9620/AZ4330Positive glue AZ 9620/AZ 4330 None 1Gallons
MerckAZ1518Positive glue AZ 1518 1-4.3μm 1Gallons
AZ 4620 Positive glue AZ 4620 10-15μm 100ml;500ml;1L;

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